Cedrik Neike, CEO of Digital Industries and board member for Siemens AG and Keyvan Esfarjani, chief global operations officer for Intel Corp. pose for a photo to mark the signing of a memorandum of understanding by the companies to advance global manufacturing efforts. The deal was signed in Santa Clara, CA, in December 2023
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Siemens and Intel Join Forces to Revolutionize Semiconductor Manufacturing

Siemens AG and Intel Corp have partnered to advance semiconductor manufacturing. The collaboration aims to enhance global manufacturing capacities by utilizing innovative technology like "digital twins" for efficiency gains. This move marks a strategic step towards refining energy management, reducing carbon emissions and catering to the escalating global semiconductor demand.